AMD TRX40 DESIGNARE Motherboard with Direct 16+3 Phases Infineon Digital VRM, Fins-Array Heatsink, Dual Intel LAN, 4 PCIe 4.0 M.2 with Thermal Guards, Bundled GC-Titan Ridge Add-In Card and AORUS Gen4 AIC Adaptor, Intel® WiFi 6 802.11ax,120dB SNR AMP-UP Audio Supports 3rd Gen AMD Ryzen™ Threadripper™ Processors Quad Channel ECC/ Non-ECC Unbuffered DDR4, 8 DIMMs 16+3 Phases Infineon Digital VRM Solution with 70A Power Stage Triple Thermal Protection with Fin-Arrays and 8mm Maga-Heatpipe Dual Intel® Gigabit LAN with cFosSpeed to shorten response time 4 Ultra-Fast NVMe PCIe 4.0 x4 M.2 with Enlarged Thermal Guards Onboard Intel® WiFi 6 802.11ax 2T2R & BT 5 with Antenna 120dB SNR AMP-UP Audio with ALC1220-VB and WIMA Audio Capacitors Bundled 40Gb/s GC-Titan Ridge Add-In Card Exclusive AORUS Gen4 AIC Adaptor for Extra 4 NVMe PCIe 4.0/3.0 x4 M.2 USB TurboCharger for Mobile Device Fast Charge Support RGB FUSION with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips Smart Fan 5 features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP and Noise Detection Front & Rear USB 3.2 Gen 2 Type-C™ Header Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card TRX40 DESIGNARE motherboard uses latest new generation Infineon multiphase PWM controller, and a total 16+3 phase for vCore and SOC, all with Infineon TDA21472 Power Stage MOSFET which is capable of providing at least 70A of power from each phase, for a total of amazing 1330A. Power design is no longer a bottleneck for this motherboard. New Direct Multiphase Power Design No Doubler / Not Parallel Next-Gen Infineon PWM Controller 70A Power Stage The Lowest Voltage Ripple The Highest Efficiency 8+8 Pin Metal Shielding Connector Fins-Array Fins-Array increases the heat dissipation surface by 300% compared to traditional heatsinks of the same size. Extended Heatpipe Heatpipes transfer heat between heatsinks to get thermal balance more quickly. 3X PCIe 4.0 M.2 Heatsink Enlarged M.2 heatsink prevents new generation PCIe 4.0 SSD from throttled performance under overheat condition. LAIRD Thermal Pad By using 1.5mm thicker 5 W/mK thermal conductivity pad, it can transfer 2.7x more heat than usual thermal pad in the same time. Ultra Durable Baseplate Aluminum baseplate is 3x thermal conductivity than steel one ensuring efficient thermal dissipation. TRX40 Chipset Heatsink Reactive chipset heatsink with grooves ensures TRX40 chipset run cool and quiet. 5cm Ball Bearing Silent Fan Built-in 5cm ball bearing fan to cool down TRX40 chipset, it will completely stop under idle condition to extend fan life cycle.